SELF-EXTINGUISHING EPOXY RESIN COMPOUND AND IMPROVEMENT OF ITS FLAME RESISTANCE

摘要

A self-extinguishing epoxy resin compound that contains no environmentally hazardous flame-retardants such as halogen or phosphorous derivatives was developed for an integrated circuit (IC) molding compound. The epoxy resin compound, mainly consisting of a phenol-biphenylene-type epoxy resin and a hardener, formed a stable foam layer that retard heat transfer, thus self-extinguished. Especially beneficial is the fact that the IC molding compound based on the epoxy resin compound shows excellent humidity resistance and high heat resistance. Furthermore, the flame retardancy and heat resistance of the phenol-biphenylene-type epoxy resin compound were increased by the inclusion of a benzoguanamine-modified phenol biphenylene resin. The benzoguanamine-modified phenol biphenylene resin contains a benzoguanamine unit to promote generation of non-flammable substances during ignition and to increase the resin's reactivity toward epoxy resins, and biphenylene units to keep the resin's thermal degradation and water resistance. The addition of the benzoguanamine-modified phenol biphenylene resin in the epoxy resin compound improved the epoxy resin compound's flame retardancy and heat resistance, and increased its glass transition temperature while maintaining its water resistance and mechanical properties.