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METHOD OF FORMING ELECTRICAL INTERCONNECTS USING ISOTROPIC CONDUCTIVE ADHESIVES AND CONNECTIONS FORMED THEREBY
METHOD OF FORMING ELECTRICAL INTERCONNECTS USING ISOTROPIC CONDUCTIVE ADHESIVES AND CONNECTIONS FORMED THEREBY
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机译:使用各向同性的导电胶形成电气互连的方法及由此形成的连接
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摘要
A method for compliant conductive interconnect whereby conductive adhesive is dispensed directly onto conductive sites of a first substrate and, while adhesive is wet or with partial or complet curing, a second substrate is aligned and placed in contact with adhesive deposits, thereby completing the interconnect. After assembly, un-filled underfill shrinks sufficiently to compress compliant adhesive and external clamping is largely eliminated. The method is scalable as low as about 6 mils with no real upper limit according to the percentage conductive particles by volume in the adhesive.
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