首页> 外国专利> CHEMICAL VAPOR DEPOSITION OF METAL SULFIDE FILMS FROM METAL THIOCARBOXYLATE COMPLEXES WITH MONODENTATE OR MULTIDENTATE LIGANDS

CHEMICAL VAPOR DEPOSITION OF METAL SULFIDE FILMS FROM METAL THIOCARBOXYLATE COMPLEXES WITH MONODENTATE OR MULTIDENTATE LIGANDS

机译:具有单齿或多齿配位体的金属硫代羧酸盐络合物的化学气相沉积金属硫化物膜

摘要

In a method of depositing a metal sulfide film on a substrate (7), a solution containing at least one metal compound precursor comprising at least one thiocarboxylate ligand SECR, wherein E is selected from the group consisting of O and S and wherein R is selected from the group consisting of alkyl, aryl, substituted alkyl, substituted aryl, halogenated alkyl, and halogenated aryl is prepared. The substrate in a substrate chamber (4) is heated to a reaction temperature by a heating means (5). The solution is evaporated to form vapors of the metal compound precursor by the use of an aerosol generator (1). The vapors and the substrate heated to the reaction temperature are contacted. The reaction temperature is sufficient to decompose the metal compound precursor to form a metal sulfide film of at least one metal on the substrate.
机译:在衬底(7)上沉积金属硫化物膜的方法中,该溶液包含至少一种包含至少一种硫代羧酸盐配体SECR的金属化合物前体,其中E选自由O和S组成的组,并且其中R选自由烷基,芳基,取代的烷基,取代的芳基,卤代烷基和卤代芳基组成的组制备。通过加热装置(5)将衬底腔室(4)中的衬底加热到​​反应温度。通过使用气溶胶发生器(1)将溶液蒸发以形成金属化合物前体的蒸气。蒸气和加热到反应温度的底物接触。反应温度足以分解金属化合物前体以在基底上形成至少一种金属的金属硫化物膜。

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