Failure analysis apparatus and failure analysis method of semiconductor wafer

摘要

Is stored in the data storage means 10 including defect position coordinates based on physical inspection results such as foreign objects and defects on the surface of the semiconductor wafer in the defect inspection apparatus 3. [;The physical position coordinate data based on the fail bit data in the tester 6 is stored in the memory end 13.;The data indicating the additional defective area based on the fail bit data is created by the additional defective area estimating means 14 and stored in the storage means 15. [;The combining means 16 creates correction physical positional interpolation data containing the limitation condition data for each defective mode stored in the storage means 15 in the physical position coordinate data stored in the storage means 13 and stores the corrected physical position coordinate data and the correction physical position coordinate data Combine defective position coordinate data.;Therefore, even if the degree of combination is increased, there is no defect caused by a defect in a defective address obtained in the fail bit data, and even if there is a defect caused by a defect in relation to being located at the defective address, the defect is analyzed The degree of estimation is improved.