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Method for cleaning metal impurities on silicon substrate mixed with UV / O_3 cleaning and HF solution cleaning

机译:紫外/ o_3清洗和HF溶液清洗混合清洗硅衬底上金属杂质的方法

摘要

The importance of silicon substrate cleaning is increasing with the increase in integration and performance of semiconductor devices. The present invention relates to a metal impurity on a silicon substrate by a dry and wet process in which dry and wet treatments are performed in order of Piranha cleaning, ultraviolet / ozone (UV / O 3 ) cleaning, HF solution cleaning, and drying to clean the silicon substrate. It relates to a cleaning method of.
机译:硅衬底清洁的重要性随着半导体器件的集成度和性能的提高而增加。本发明涉及通过干湿法在硅衬底上的金属杂质,其中以食人鱼清洗,紫外线/臭氧(UV / O 3 )清洗的顺序进行干法和湿法处理, HF溶液清洗,并干燥以清洗硅基板。它涉及一种清洁方法。

著录项

  • 公开/公告号KR970003569A

    专利类型

  • 公开/公告日1997-01-28

    原文格式PDF

  • 申请/专利权人 전형탁;최형복;

    申请/专利号KR19950015204

  • 发明设计人 전형탁;최형복;

    申请日1995-06-09

  • 分类号H01L21/304;

  • 国家 KR

  • 入库时间 2022-08-22 03:18:33

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