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Method for cleaning metal impurities on silicon substrate mixed with UV / O_3 cleaning and HF solution cleaning
Method for cleaning metal impurities on silicon substrate mixed with UV / O_3 cleaning and HF solution cleaning
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机译:紫外/ o_3清洗和HF溶液清洗混合清洗硅衬底上金属杂质的方法
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摘要
The importance of silicon substrate cleaning is increasing with the increase in integration and performance of semiconductor devices. The present invention relates to a metal impurity on a silicon substrate by a dry and wet process in which dry and wet treatments are performed in order of Piranha cleaning, ultraviolet / ozone (UV / O 3 ) cleaning, HF solution cleaning, and drying to clean the silicon substrate. It relates to a cleaning method of.
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机译:硅衬底清洁的重要性随着半导体器件的集成度和性能的提高而增加。本发明涉及通过干湿法在硅衬底上的金属杂质,其中以食人鱼清洗,紫外线/臭氧(UV / O 3 Sub>)清洗的顺序进行干法和湿法处理, HF溶液清洗,并干燥以清洗硅基板。它涉及一种清洁方法。
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