Multi-layered wiring structure and multi-layered wiring board and multi-layered semiconductor device having same

摘要

The multilayer wiring structure having the combustion suppression characteristic corresponding to V-O of the UL 94 standard is installed without sensitizing the inherent characteristics of the benzocyclobutene resin. A low level interlayer insulating layer formed to cover the low level interconnection layer, a high level interconnection layer formed on the low level interlayer insulating layer, a high level interlayer insulating layer formed to cover the high level interconnection layer, and a protective layer formed to cover the high level interlayer insulating layer It's possible. The small low-level and high-level interlevel insulating layers are made of benzocyclobutene resin. The protective layer has combustion inhibition and non-flammability corresponding to the V-O rating of the UL 94 standard. The protective layer may be made of a combustion inhibiting material such as a fluoro resin, a polyimide resin and an epoxy resin. The protective layer may be made of a non-flammable material such as silicon dioxide or silicon nitride.