A method of generating stacking failure induced damage on the back surface of semiconductor wafer

摘要

The present invention relates to a method of generating stacking-fault-inducel damage on a back surface by treating the back surface of a semiconductor wafer with loose hard material particles suspended in a liquid.;The characteristic of this method is to contact the hard material particles suspended in the back surface of the semiconductor wafer, and to drive the hard material particles inclined to the back surface so that these particles have a mainly radial component on the back surface of the semiconductor wafer under such a condition. To force it.