New Copolymer Having Thermal Melt Adhesion, Its Particles, Film and Laminated Heat Insulation Material, Electronic Module and Capacitor, and Method of Manufacturing the Same (Novel Copolymer Having Thermal Fusible Adhesiveness / Powder Particles, Film, Laminated Heat Insulating Material. Made there from, and Methods for Producing said Objects.

摘要

Disclosed is a novel copolymer which is excellent in mechanical strength, radiation resistance, chemical resistance, low temperature characteristics, heat resistance, processability and adhesiveness, and simultaneously has low heat absorbability and excellent dielectric properties, and at the same time, A film, a film, a heat-sealable film for covering a wire, a lidded insulator, an electronic module, and a capacitor using a thermoplastic polyimide resin as a raw material.;The novel copolymer having heat-sealability according to the present invention has a glass transition point of 100 to 250C, a water absorption of 1% or less and a dielectric constant of 3 or less,;(Wherein Ar_OneIs a 4-valent organic group, Ar₂Is a divalent organic group, R is a divalent organic group, and X is a trivalent linking group. M and n are 0 or an integer of 1 or more, and the sum of m and n is 1 or more and 1 is an integer of 1 or more). It is also possible to use a thermoplastic polyimide resin mainly composed of this copolymer to form a powder or a film which has the characteristics of the copolymer and can be suitably used as an electronic component and an electronic circuit component material to be used for high-, A lyophilic film, an insect insulator, an electronic module and a capacitor.