Method and device for selective unsticking of boards bonded onto a substrate, and their application to the repair of hybrid circuits

摘要

The present invention relates to a method and a device for unsticking boards bonded onto a substrate. The method according to the invention for unsticking a board attached by bonding onto a substrate, is characterised in that it consists in carrying out limited heating of the board to be unstuck, then in exerting a shear force on the heated board in order to bring about unsticking. The method according to the invention may be implemented with the aid of a device including means for selectively heating each of the boards to be destroyed, and means for exerting a shear force on each of the heated boards. The method and the device are particularly appropriate for repairing hybrid circuits. IMAGE