Lead frame having cut-out wing leads

摘要

In a remote tie-bar lead frame 10 rising an island 4 for bearing a semiconductor chip, one pair of hanger pins 1 for supporting the island 4, a number of outwardly extending leads 2 located to surround the island 4 separately from the island 4, and a pair of tie-bars 6 for mutually tying the leads so as to prevent a flow-out of a resin when a resin packaging is carried out, one pair of wing leads 3A outwardly extend from a pair of opposite sides of the island 4 orthogonal to the pair of opposite sides from which the hanger pins 1 extends. Each of the wing leads 3A extends between a pair of adjacent leads, but terminates to slightly outwardly project from a mold line 5.