An apparatus including a structure which separates a first transport robot (high temperature robot), which accesses a first processing part group including the thermal processing parts, from a second transport robot (low temperature robot) which accesses the only non-thermal processing parts. During circulating transportation of substrates to be processed, heat created at thermal processing parts is prevented from flowing into non-thermal processing parts. Semiconductor wafers are circulated one by one between the first processing part group which includes a hot plate and a second processing part group which does not include a hot plate and processed one at a time at each processing part. The high temperature robot accesses the first processing part group while the low temperature robot accesses the second processing part group. Transfer of a semiconductor wafer between the two robots is performed at a transfer part which is formed using a cool plate. Since the low temperature robot is never subjected to heat, temperatures at the non- thermal processing parts which are included in the second processing part group remain stable even when the low temperature robot accesses the non- thermal processing parts.
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