HIGH-PERMITTIVITY RESIN COMPOSITION, HIGH-PERMITTIVITY PREPREG, AND HIGH-PERTMITTIVITY LAMINATE

摘要

PROBLEM TO BE SOLVED: To obtain a compsn. which can produce a high-permittivity laminate while using a smaller amt. of an inorg. powder and which enables the improvement in moldability and punchability by using, as the essential ingredients, a resin having dihydrobenzoxazine rings in the molecule, a resin component comprising a compd. reactive with a dihydrobenzoxazine ring and a phenolic hydroxyl group formed by opening a dihydrobenzoxazine ring, and a high- permittivity inorg. powder. ;SOLUTION: The resin having dihydrobenzoxazine rings in the molecule is obtd. by reacting a compd. having at least two phenolic hydroxyl groups in the molecule, a prim. amine, and formaldehyde. Examples of the resin component comprising a compd. reactive with a phenolic hydroxyl group are a phenolic hydroxyl compd. and an at least difunctional epoxy resin. The high- permittivity inorg. powder is e.g. a titanium dioxide ceramic and is compounded in an amt. of 80-250wt.% of the resin component. When the powder is compounded in an amt. lower than 140wt.%, a prepreg for bonding printed circuit boards is obtd.;COPYRIGHT: (C)1998,JPO