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BINARY OPTICS AND LASER BEAM MACHINING DEVICE

机译:二元光学和激光束加工设备

摘要

PROBLEM TO BE SOLVED: To make a laser machining process advantageous and to enable efficient machining by designating the arraying direction and the pitch of diffraction grating at each position on a binary optics corresponding to the shape and the intensity distribution of incident light the straight, belt-like of desired intensity distribution of an emitted light to convert. SOLUTION: A laser beam forms a circular beam shape and is magnified by a beam magnifier before entering the binary optics 3 to enter to match its optical axis with the center of the optics. At the time of setting the length of a line segment PQ to be (d) and the wavelength of light to be , a distance to the position of obtaining desired intensity distribution from the optics 3 to be (h), the pitch (p) is expressed as p=(1+h2 /d2 ) at the diffraction grating of this optics 3.
机译:解决的问题:通过指定与入射光的形状和强度分布对应的二元光学器件上每个位置上的衍射光栅的排列方向和间距,可以使激光加工工艺更加有利并实现高效加工,从而实现直形,带状类似于所希望的发射光的强度分布以进行转换。解决方案:激光束形成圆形光束形状,并在进入二元光学器件3之前通过光束放大器放大,以使其光轴与光学器件的中心匹配。将线段PQ的长度设为(d),将光的波长设为时,距从光学器件3获得所需强度分布的位置的距离为(h),间距为(p)在该光学器件3的衍射光栅处表示为p =(1 + h 2 / d 2)。

著录项

  • 公开/公告号JPH10282450A

    专利类型

  • 公开/公告日1998-10-23

    原文格式PDF

  • 申请/专利权人 NIPPON STEEL CORP;

    申请/专利号JP19970083969

  • 申请日1997-04-02

  • 分类号G02B27/09;B23K26/06;H01S3/00;

  • 国家 JP

  • 入库时间 2022-08-22 03:08:00

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