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TWO-DIMENSIONAL PLANE CUTTING METHOD OPTIMIZING DEVICE

机译:二维平面切割方法优化装置

摘要

PROBLEM TO BE SOLVED: To provide a device determining an optimum cutting method in a short time even in the case of large n value, relating to a two-dimensional plane cutting method optimizing device obtaining an optimum cutting method minimizing a waste area, in the case of cutting out a prescribed number of sheets of small planes from a number of n sheets of two-dimensional planes. ;SOLUTION: A two-dimensional plane cutting information acquisition part 2 acquires information of how to cut pattern or the like relating to cutting of a two-dimensional plane. In a fitness function setting part 3, a weight coefficient is set to a fitness function used in an optimization processing part 4. In the optimization processing part 4, based on information obtained from the plane cutting information acquisition part 2, a group of chromosome, represented by a row or the like of how to cut pattern number in accordance with each two-dimensional plane, is generated, by genetic algorithm, genetic operation of selection, crossing, sudden variation of the chromosome is repeated, optimum solution or that approximate to the optimum solution is obtained.;COPYRIGHT: (C)1998,JPO
机译:解决的问题:提供一种即使在n值大的情况下也能在短时间内确定最佳切割方法的装置,该装置涉及一种二维平面切割方法优化装置,该装置在最小化浪费区域的情况下获得最佳切割方法。从n个二维平面中切出规定数量的小平面的情况。 ;解决方案:二维平面切割信息获取部分2获取有关如何切割与二维平面切割有关的图案等的信息。在适应度函数设置部分3中,权重系数被设置为在优化处理部分4中使用的适应度函数。在优化处理部分4中,基于从平面切割信息获取部分2获得的信息,一组染色体,通过遗传算法,生成由如何根据每个二维平面切割模式数的行等表示的,重复选择,杂交,染色体突变的遗传操作,最优解或近似于获得最佳解决方案。;版权所有:(C)1998,日本特许厅

著录项

  • 公开/公告号JPH1015727A

    专利类型

  • 公开/公告日1998-01-20

    原文格式PDF

  • 申请/专利权人 FUJITSU LTD;

    申请/专利号JP19960173559

  • 发明设计人 TAJIMA KOJI;

    申请日1996-07-03

  • 分类号B23D36/00;B23Q15/00;B26D5/00;G05B13/02;G06F15/18;

  • 国家 JP

  • 入库时间 2022-08-22 03:07:39

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