MANUFACTURE OF INTEGRATED MICROSTRUCTURE OF SEMICONDUCTOR MATERIAL AND INTEGRATED MICROSTRUCTURE OF SEMICONDUCTOR MATERIAL

摘要

PROBLEM TO BE SOLVED: To provide an integrated microstructure which is low-cost and which can be integrated into one chip together with a control electronic circuit. ;SOLUTION: A sacrificial buried region is formed on a substrate 1, a semiconductor material layer in which a polycrystal region is formed on the sacrificial buried layer and in which a single-crystal region 81 is formed in parts other than the region is grown, a part of the polycrystal region is removed, grooves 2 which reach the sacrificial durid layer from the surface are formed, the sacrificial buried layer is removed via the grooves 20, and a gap 21 is formed. Thereby, parts 80', in the polycrystal region, which are surrounded by the grooves 20 form a hanging structure which is isolated thermally from other parts. Since electronic components 12 to 14 are formed on the single-crystal region by using a microelectronics process, the electronic components are integrated on the same chip together with a microstructure.;COPYRIGHT: (C)1998,JPO