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METHOD FOR ETCHING SILICON, PRODUCTION OF SILICON MEMBER AND ETCHED SINGLE CRYSTAL SILICON

机译:刻蚀硅的方法,硅成员的生产和刻蚀的单晶硅

摘要

PROBLEM TO BE SOLVED: To provide an etching method of silicon by which generation of projection and roughness is prevented, a manufacturing method of a silicon member and etched single crystal silicon. ;SOLUTION: Silicon is etched by using an etchant added with a chelating agent. In this case, the chelating agent combines with metal ions and dissolved silicon itself in the etchant to prevent the metal ions and dissolved silicon from attaching to an etching surface and generating projection. Otherwise, silicon is etched by using the etchant added with ketone or aldehyde. In this case, hydrogen is consumed by reacting with ketone or aldehyde to restrain generation of bubbles.;COPYRIGHT: (C)1998,JPO
机译:解决的问题:为了提供一种硅的蚀刻方法,该硅的蚀刻方法可以防止突起和粗糙度的产生,该硅构件的制造方法和蚀刻的单晶硅。 ;解决方案:使用添加了螯合剂的蚀刻剂对硅进行蚀刻。在这种情况下,螯合剂在蚀刻剂中与金属离子和溶解的硅本身结合,以防止金属离子和溶解的硅附着到蚀刻表面并产生凸起。否则,通过使用添加有酮或醛的蚀刻剂来蚀刻硅。在这种情况下,氢通过与酮或醛反应以抑制气泡的产生而被消耗。;版权所有:(C)1998,日本特许厅

著录项

  • 公开/公告号JPH1046369A

    专利类型

  • 公开/公告日1998-02-17

    原文格式PDF

  • 申请/专利权人 HITACHI CABLE LTD;

    申请/专利号JP19960202017

  • 发明设计人 KOBAYASHI MASARU;

    申请日1996-07-31

  • 分类号C23F1/40;H01L21/306;H01L21/308;

  • 国家 JP

  • 入库时间 2022-08-22 03:06:08

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