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Formation structure and the series resonance circuit null of the distribution capacitor in substrate

机译:基板中的分布电容器的形成结构和串联谐振电路为零

摘要

PURPOSE: To facilitate and adjustment of the capacitance by adopting a distributed capacitor comprising a distributed constant for a capacitor of an electronic circuit such as a series resonance circuit and making a hole in a base plate in the vicinity of the distributed constant capacitor so as to avoid dispersion in the capacitance of the distributed capacitor. ;CONSTITUTION: A hole surrounding one terminal of a coil L is made in a base plate in the vicinity of the one terminal of the coil L. Since the base plate has a larger dielectric constant than that of air, the hole is made to remove the base plate in existence between the coil L and a copper foil provided to the lower side of the base plate and connecting to ground. Thus, the capacitance of a distributed capacitor in existence between the coil L and the copper foil forming a ground plane and connecting to ground is reduced. Furthermore, a conductor 1 is provided and its both ends are connected to the copper foil on the rear side of the base plate and to ground. The distance between the conductor 1 and the coil L is changed by tilting the conductor 1 with respect to the base plate. The capacitance of the distributed constant capacitor C3 comprising the distributed circuit constant is the sum of the distributed capacitance between the coil L and the conductor 1 and the distributed capacitance between the coil L and the copper foil on the base plate. The distance between the coil L and the conductor 1 is changed by tilting the conductor 1 with respect to the base plate to change the capacitance of the capacitor C3.;COPYRIGHT: (C)1996,JPO
机译:目的:通过采用包括用于电子电路电容器(例如串联谐振电路)的电容器的分布常数的分布电容器,并在分布常数电容器附近的基板上开孔,以促进和调节电容。避免分散电容器的电容分散。 ;构成:在线圈L的一个端子附近的基板上开有一个围绕线圈L的端子的孔。由于该基板的介电常数比空气大,因此要去除该孔。基板L存在于线圈L和设置在基板的下侧并接地的铜箔之间。因此,减小了在线圈L和形成接地平面并接地的铜箔之间存在的分布电容器的电容。另外,设置导体1,导体1的两端与基板的背面侧的铜箔连接并接地。通过相对于基板倾斜导体1来改变导体1与线圈L之间的距离。包括分布电路常数的分布常数电容器C 3 的电容是线圈L和导体1之间的分布电容与线圈L和导体上的铜箔之间的分布电容之和。底盘。通过使导体1相对于基板倾斜以改变电容器C 3 的电容来改变线圈L与导体1之间的距离。版权所有:(C)1996,JPO

著录项

  • 公开/公告号JP2798898B2

    专利类型

  • 公开/公告日1998-09-17

    原文格式PDF

  • 申请/专利权人 日本アンテナ株式会社;

    申请/专利号JP19950045118

  • 发明设计人 榎原 一夫;

    申请日1995-02-10

  • 分类号H03H7/075;H01P7/00;H03H5/00;

  • 国家 JP

  • 入库时间 2022-08-22 03:03:35

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