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PLATING BATH OF NICKEL, COBALT OR NICKEL-COBALT ALLOY AND PHOSPHORUS AND PLATING METHOD

机译:镍,钴或镍钴合金和磷的镀液及镀覆方法

摘要

PROBLEM TO BE SOLVED: To provide a plating bath with the cathode current efficiency and anode current efficiency well-balanced, hence without the metallic ion concn. being remakably increased, capable of maintaining the metallic ion concn. at a fixed level by selecting the anode current density and anode and capable of providing a plating film having a stabilized content of P over a long period. ;SOLUTION: This plating bath of nickel, cobalt or nickel-cobalt alloy and phosphorus for a soluble anode contains 6-30g/l water-soluble salt of metal selected from nickel and cobalt as the metallic ion, 150-800g/l at least one kind among the water-soluble sulfate, sulfamate and methane sulfamate of the metal selected from alkali metals and alkaline-earth metals as the conductive salt, 1-100g/l phosphorous acid or its salt and ≤100mg/l halogen ion and is controlled to pH0.8 to 5.;COPYRIGHT: (C)1998,JPO
机译:要解决的问题:提供一种镀液,使阴极电流效率和阳极电流效率保持平衡,因此没有金属离子的浓度。显着增加,能够保持金属离子浓度。通过选择阳极电流密度和阳极,可以在固定的水平上形成膜,并且能够长期提供具有稳定的P含量的镀膜。 ;解决方案:用于可溶性阳极的镍,钴或镍钴合金和磷的镀浴包含6-30g / l选自镍和钴的金属水溶性金属盐作为金属离子,至少150-800g / l选自碱金属和碱土金属中的金属的水溶性硫酸盐,氨基磺酸盐和甲烷氨基磺酸盐中的一种作为导电盐,1-100g / l亚磷酸或其盐和≤100mg/ l卤素离子而受控制到pH0.8到5 .;版权:(C)1998,JPO

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