FORMATION OF COPPER-SILVER ALLOY COATING FILM AND COMPOSITION FOR FORMING COPPER-SILVER ALLOY COATING FILM

摘要

PROBLEM TO BE SOLVED: To uniformly form coating film with low resistance at a relatively low reacting temp. and at a high film coating forming speed, in the formation of Cu-Ag alloy coating film, by using an organic Cu (I) compound and an organic Ag (I) compound with ligands different mutually. ;SOLUTION: The vapor of an organic Cu (I) compound shown by the formula I and the vapor of an organic Ag (I) compound shown by II are decomposed to accumulate a Cu-Ag alloy on a substrate, by which Cu-Ag alloy coating is formed. In the formula I and formula II, L¹ and L² denote olefins, alkynes or organic phosphines substituted with trimethylsilyl, and (n) denotes 2, 3 or 4. Furthermore, the ligands L¹ of the compound in the formula I and the ligands L² of the compound in the formula II are mutually different, and at least either of the L¹ and L² is ethane or propane substituted with trimethylsilyl groups. The compound in the formula I and the compound in the formula II are vaporized in separate vaporizing chambers, and after that, each vapor is introduced into a coating film forming chamber together with a carrier gas and is decomposed.;COPYRIGHT: (C)1997,JPO