PURPOSE:To improve the yield and the packing density of the titled module by providing a mounted electrode which can mount a memory component for a defect remedy alternative to a memory chip. CONSTITUTION:For example, when a memory chip MC 8 is defective, first, a plastic leaded chip carrier (PLCC) memory component for the defect remedy, etc., are mounted and connected to a mounted electrode RDP. Next, a redundant pattern wiring RDDL is connected to a pattern wiring DL 8 with a jumper line JL, etc., and simultaneously, the coupled condition of the defective memory chip MC 8 and an external data input output terminal D 8 is disconnected at the position of an X mark in the figure. For the disconnection of a pattern wiring DL 8, a mechanical trimming and a laser trimming are adopted.
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