PRINTED WIRING BOARD MOUNTED WITH SURFACE-MOUNT COMPONENT, PRINTED WIRING BOARD, AND CHIP SURFACE MOUNT COMPONENT

摘要

PROBLEM TO BE SOLVED: To lessen a printed wiring board in thickness and size when a chip surface mount component is mounted on a board by a method wherein the component is lessened in protrusion from the board. ;SOLUTION: A recess 54 where a chip component 52 is partially inserted is provided in a board 50, and pad patterns 56 and 68 are formed on the board 50 proximate to the electrodes of the chip component 52 partially put in the recess 54. The chip component 52 is put into the recess 52, and the electrodes of the chip component 52 are soldered to the pad patterns 56 and 68. The main body 66a of a surface mount IC 66 is placed on the chip component 52, and the leads 66b of the IC 66 are connected to IC pad patterns 68 formed on the surface of the board 50, whereby a printed wiring board of this constitution can be more enhanced in mount density.;COPYRIGHT: (C)1997,JPO