RANGKAIAN TERPADU SEMIKONDUKTOR DAN SISTEM YANG MENGGUNAKAN RANGKAIAN TERSEBUT

摘要

PROBLEM TO BE SOLVED: To reduce to the minimum the increase in chip area and the influence of increase in wiring delay by a method in which a plurality of terminal cells have a connection part to be used for mediation of communication between a semiconductor integrated circuit and one of a plurality of substrate cells. ;SOLUTION: A plurality of data columns 12 contain plural fundamental cells 20 and at least a terminal cell 22. Fundamental cells 20a and the terminal cells 22a, to be connected to the fundamental cells 20a, are adjacently arranged in the same data column 12, and fundamental cell 20b and the terminal cell 22b, to be connected to the fundamental cell 20b, are adjacently arranged in the same column 12. As a result, a module is formed by laminating a semiconductor integrated circuit and other semiconductor integrated circuit. By this lamination, a plurality of kinds of semiconductor integrated circuits and by changing a part (connection layer) of the other semiconductor integreated circuit, a plurality of kinds of semiconductor integrated circuits can be interfaced. As a result, the developing manhours of the module can be decreased.;COPYRIGHT: (C)1998,JPO