Test substance and rigid substrate bonding strength determining system - determines critical pressure required to de-bond continuous periphery of area in test substance from substrate

摘要

The system includes a thin film for covering aperture interposed between the test substance and the substrate atop the aperture and extending beyond the perimeter of the aperture. A device is provided for applying increasing pressure through the aperture in the substrate to de-bond the test substance from the substrate. A device is incorporated for determining the critical pressure required to de-bond a continuous periphery of an area in the test substance from the substrate. The critical pressure is directly related to the specific work of debonding. As in the failure of the adhesive bond of the test adhesive (12), the pressure-sensitive adhesive bond of the pressure-sensitive adhesive layer (22) with the surface (18) of the substrate (14) fails almost at once. This failure occurs due to internal separation within the test adhesive (12), indicated generally at (62).