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PROCEDURES FOR RESEARCH OF ACID COPPER PLACING BASES AND FOR THE RECOVERY OF METAL COPPER FROM SOLUTIONS AND SLAMS CONTAINING COPPER IN JOHN-FORM

机译:酸性铜基料的研究程序和从含铜的溶液和渣中回收金属铜的方法

摘要

Method to prevent the exhaustion of acid copper plating baths (12) and to treat sewage or sludges (20) containing copper in an ionic form so as to recover metallic copper (39), the method including the addition (11) of a compound which keeps the concentration of iron below a critical value (for instance, 60 grs/lt.), the compound causing precipitation of iron in the form of ferrous sulphate and thus preventing the co-deposition of crystals of ferrous sulphate and copper sulphate with a possible incorporation of organic impurities such as stearates (35) present in the acid cooper plating baths (12). IMAGE
机译:包括添加(11)化合物的方法,该方法用于防止酸性镀铜浴(12)耗尽,并处理包含离子形式的铜的污水或污泥(20)以回收金属铜(39)。使铁的浓度保持在临界值以下(例如60 grs / lt。),该化合物会导致硫酸亚铁形式的铁沉淀,从而可能防止硫酸亚铁和硫酸铜晶体的共沉积引入存在于酸性铜电镀液(12)中的有机杂质,例如硬脂酸盐(35)。 <图像>

著录项

  • 公开/公告号AT159301T

    专利类型

  • 公开/公告日1997-11-15

    原文格式PDF

  • 申请/专利权人 LABORATORI TABOGA DI TABOGA LEANDRO;

    申请/专利号AT19940111036T

  • 发明设计人 TABOGA LEANDRO;

    申请日1994-07-15

  • 分类号C23C18/38;C01G3/10;C25D3/38;C25D21/18;

  • 国家 AT

  • 入库时间 2022-08-22 02:55:11

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