Copper-based lead frame in which an iron-based alloy plate is bonded to a die pad, a manufacturing method thereof, and a semiconductor chip package using the same

摘要

The present invention relates to a lead frame, a method of manufacturing the same, and a semiconductor chip package using the same, wherein in a die pad to which a semiconductor chip is attached, a surface on which the semiconductor chip is attached is an iron alloy layer, and a hole is formed in a lower surface of the iron alloy layer. By providing a copper-based lead frame in which the formed copper layers are bonded and the external leads mounted on the printed circuit board are copper and a semiconductor chip package using the same, the die pad has an iron-based alloy layer having a similar thermal expansion coefficient to that of the semiconductor chip. Therefore, it is possible to overcome the chip crack failure caused by the conventional thermal stress, to effectively dissipate heat generated in the semiconductor chip through the copper layer, the molding resin is filled in the hole of the copper layer, the bonding force between the molding resin and the lead frame There is an increasing advantage.;In addition, the semiconductor chip package using the copper-based lead frame also has the advantage of good mounting reliability on the printed circuit board because the external lead is a copper material.;That is, the lead frame according to the present invention may be said to combine the advantages of the conventional copper-based lead frame and the advantages of the iron-based lead frame.