METHOD FOR MANUFACTURING MATERIAL FOR COPY ALLOY SEMICONDUCTOR LEAD FRAME HAVING HIGH STRENGTH AND HIGH ELECTROPHIC

摘要

The present invention relates to a method of manufacturing a Cu-Ni-Si-P-Ti based copper alloy lead frame material, which is characterized by having a tensile strength of 60 kg / mm 2 and a lead frame material And the type and behavior of the precipitates contributing to the strengthening were investigated. It was confirmed that the effects of the processing on the precipitation reaction and the effect of the crystal grains in the crystal grains as the F-TMT process (NiTi, S-Ni, Ni-Si, and Ni-Ni)₂Si) to manufacture a material for a copper alloy semiconductor lead frame having high strength and high electrical conductivity.