Manufacturing method of low stress modified silicone epoxy resin for semiconductor device encapsulation and resin composition for semiconductor device encapsulation containing same

摘要

The present invention relates to a method for producing a low-stressed silicone-modified epoxy resin for semiconductor element encapsulation, and an epoxy resin composition using the same, more specifically, a silicone oil having a molecular weight of 200-1,000 in a silicone oil having a sock end or single-ended amine group. And a method of preparing a low stress silicone modified epoxy resin by reacting a mixture of a silicone oil having a molecular weight of 1,500-20,000 with one or a mixture of biphenyl type epoxy resins and bisphenol A type epoxy resins under reduced cost. An epoxy resin composition for semiconductor element sealing containing a low stress silicone modified epoxy resin.