Distance measurement Kai

摘要

The distance measurement IC has a built-in oscillator in the package. A planar inductor is formed on the surface of the package containing the oscillator. The planar inductor is connected to an oscillator to specify the oscillation frequency of the oscillator. When the conductive material approaches the package surface, the oscillation frequency of the oscillator changes by the planar inductor. The oscillation frequency is detected, and the approach distance of the conductive material is detected. The conductive material is mainly a metal, but it is also possible to measure the approach distance with a conductive material other than a metal, for example, a conductive liquid.