POLISHSTOP PLANARIZATION STRUCTURE

摘要

The present invention provides a method for producing a substantially flat surface that overlies the shape of a semiconductor structure. The method includes forming alternating layers of alternating hard and soft polishing materials over the shape of the semiconductor structure, and then polishing the alternating layers to form a substantially flat surface over the shape. This method uses the policy speeds of the various materials used as alternating layers to improve the planarization process.