ELECTROPLATING SOLUTION OF ZN-NI ALLOY FOR IMPROVEMENT OF BONDING PROPERTY AND NI PRECIPATE RATE OF PLATING LAYER

摘要

The present invention relates to a zinc-nickel alloy electroplating solution, which is mainly composed of zinc chloride and nickel chloride, and is used in plating baths using potassium chloride, sodium chloride, barium chloride and ammonium chloride as conduction aids, and an aryl alcohol-based additive. By adding alcohol in an appropriate range, it is to provide a zinc-nickel alloy electroplating solution that can improve the nickel deposition ratio and adhesion of the gilding worms during plating, and its purpose.;The present invention for achieving the above object is zinc ion concentration: 1.0-2.0mol / l, nickel ion concentration: 0.15-0.5mol / l, chlorine ion concentration: 5.0-9.0mol / 1, the aryl in the plating solution composed of the remaining water The zinc-nickel alloy electroplating solution for improving the nickel deposition ratio and adhesion of the plating layer, characterized in that the molar concentration ratio between the chlorine ion and the aryl alcohol alcohol is adjusted to be in the range of 1: 0.0005-0.05 by adding alcohol alcohol. The main point is to provide.