Low-EMI electronic equipment, low-EMI circuit board, and manufacturing method thereof (LOW-EMI ELECTRONIC APPARATUS, LOW-EMI CIRCUIT BOARD, AND METHOD OF MANUFACTURING THE LOW-EMI CIRCUIT BOARD)

摘要

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an EMC-compliant electronic apparatus which is becoming increasingly important in terms of high-speed and high-density IC and LSI elements and circuits, and in order to provide an electronic apparatus in which unnecessary radiation is suppressed at a mounted circuit board level, By forming a structure in which a resistance layer (resistive layer) and another grounding layer are added to the layer, it is possible to equivalently reduce the Q value of the solid-layer inter-layer stray capacitance seen from the power source layer and the ground layer, Thereby forming a sealed type shielding structure.;By doing so, the Q value of the stray capacitance is equivalently reduced, absorbing the potential fluctuation (resonance) generated in the power supply loop, absorbing the standing wave in the matching terminated parallel plate line and sealing the shield, There is an effect that it is greatly suppressed.