ELECTRIC CONNECTOR FOR LARGE HIGH-DENSITY MULTIPIN PIN

摘要

The present invention relates to a semiconductor device comprising at least one insulating side support, an insulating intermediate side support, a first longitudinal portion secured to the insulating side support and a second longitudinal portion secured to the insulating intermediate side support, And an exposed third longitudinal portion interposed between the two longitudinal portions. The connector also includes a socket comprising at least one insulative support and a wire comprising a first longitudinal portion secured to the insulative support and an exposed second longitudinal portion of the plug. The present invention also relates to a method of manufacturing such a connector and a mold used therefor.