Chemical structuring of surfactant pastes for the purpose of preparation of highly active surfactant granules

摘要

The application of the method described in the invention results in the surface metallization of dielectric materials. This method comprises a first step in which a metal powder, the grain size is between 10 and 5000 nm, is deposited, and then incorporated into the surface of the dielectric material. In the second step of the method, the dielectric and metal impreégné matérieu is immersed in an autocatalytic bath which causes the overlapping areas of the impregnated material by a layer of the metal contained in the bath in a thickness proportional to the immersion time. The process described in the invention enables also metallized materials such as oxides, polymers and composites containing these oxides and / or these polymers. The characteristics of the metal deposits are controlled by the type of metal, size and géeométrie of metal powder particles on the one hand, by the type and structure of the dielectric material covered with such deposits, on the other hand.