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Cationic polysaccharides modified, for the adhesive compositions containing them and 1995 for the bonding of plane structures employing these compositions
Cationic polysaccharides modified, for the adhesive compositions containing them and 1995 for the bonding of plane structures employing these compositions
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机译:改性的阳离子多糖,用于包含它们的粘合剂组合物,1995用于使用这些组合物粘合平面结构
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摘要
The invention relates to a novel composition for sizing, internal or external, of plane structures, in particular of paper, cardboard or of films. & br / the composition for sizing according to the invention contains a cationic polysaccharide n - alcénylsuccinylé having undergone an additional modification of the anionic or nonionic. & br / said polysaccharide may be constituted, in particular, of a cationic starch - octenylsuccinylated n or n - dodécénylsuccinylé, cutback or not, and modified by esterification, etherification, sulphonation or crosslinking. & br / the composition for sizing according to the invention can advantageously be applied to the bonding of plane structures intended for printing and / or writing, including cases of papers and papers for impact-free printing, such as the ink jet printing.
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