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Method of fabricating seamless tungsten plug employing tungsten redeposition and etch back
Method of fabricating seamless tungsten plug employing tungsten redeposition and etch back
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机译:利用钨再沉积和回蚀的无缝钨塞的制造方法
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摘要
A process has been developed in which seamless tungsten plugs are used to fill deep, narrow contact holes. The process features initially forming a tungsten plug in a contact hole, via tungsten LPCVD processing, followed by an RIE etch back, and recessing process. A second tungsten LPCVD procedure is then used to fill seams or defects in the underlying tungsten plug. Another RIE etch back procedure is then employed to create a seamless, composite tungsten plug structure, in the deep, narrow contact hole.
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