Method for producing a semiconductor component with electrical connection terminals for high integration density

摘要

A semiconductor component, wherein the common power supply is fed via buried metal layers (7, 9) which are present over the entire area and are connected to active functional elements (1) by vertical conductive connections (13, 15), the planes with which contact is not intended to be made being insulated from these vertical connections (13, 15) by dielectric (11) sheathing the latter.