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HIGH FREQUENCY CIRCUIT BOARD, HIGH FREQUENCY SIGNAL MEASURING PROBE AND HIGH FREQUENCY SIGNAL MEASURING METHOD EMPLOYING IT

机译:高频电路板,高频信号测量探头以及采用该电路板的高频信号测量方法

摘要

PROBLEM TO BE SOLVED: To measure the high frequency signal from a high frequency circuit on a high frequency circuit board accurately while reducing the size thereof. ;SOLUTION: A conduction path 10 from a high frequency circuit to an antenna is formed on one side of a circuit board 1 having the opposite side arranged with a measuring land terminal 22 comprising a main land terminal 23 and an outer land terminal 24 disposed oppositely to the conduction path 10. The main land terminal 23 is connected through a through hole 28 with the conduction path 10. A measuring probe 30 comprises inner and outer conductors 32, 33 formed coaxially through an insulating member 33. The inner conductor 32 projects slidingly from the forward end of the outer conductor 33. The inner and outer conductors 32, 33 are brought into contact with the main land terminal 23 and the outer land terminal 24, respectively, and a high frequency is taken out from the measuring land terminal 22 and measured.;COPYRIGHT: (C)1999,JPO
机译:解决的问题:在减小高频电路板尺寸的同时,准确地测量高频电路板上高频电路的高频信号。 ;解决方案:从高频电路到天线的传导路径10形成在电路板1的一侧,电路板1的另一侧布置有测量连接盘端子22,该测量连接盘端子包括主连接盘端子23和相对设置的外部连接盘端子24主接地端子23通过通孔28与导电路径10连接。测量探针30包括通过绝缘构件33同轴形成的内部和外部导体32、33。内部导体32滑动地突出。从外部导体33的前端起,内部导体32和外部导体33分别与主接地端子23和外接地端子24接触,并从测量接地端子22取出高频。 ;版权:(C)1999,日本特许厅

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