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EMBOSS CARRIER TAPE PACKAGING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE PACKAGING METHOD USING THIS EMBOSS CARRIER TAPE
EMBOSS CARRIER TAPE PACKAGING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE PACKAGING METHOD USING THIS EMBOSS CARRIER TAPE
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机译:压载带包装的半导体器件和使用该压载带的半导体器件包装方法
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摘要
PROBLEM TO BE SOLVED: To manufacture an emboss carrier tape preventing the generation of cracks, breakages and the like on the tape at the time of releasing a top cover tape bonded on the upper face of the emboss carrier tape in the mounting and assembling process for the emboss carrier tape storing semiconductor devices. SOLUTION: When a frame section 3 holding a plurality of pocket sections 1 in which semiconductor devices 2 are stored is bonded with a top cover tape 1, and the shortest distance from the ends of pocket sections 7 to the end of the top cover tape 1 is set as L, the distance M between a bonding section 4 on which the top cover tape 1 is bonded on the frame 3 in the same direction and the ends of the pocket sections 7 is formed in the range of L×1/10 or longer to L×7/10 or shorter so that the vicinity of the ends of the pocket sections 7 are not bonded thereon.
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