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CURRENT PROBE, ITS MANUFACTURE, CORE USED FOR MANUFACTURING, AND CURRENT PROBE ARRAY

机译:当前探针,其制造,用于制造的核心以及当前探针阵列

摘要

PROBLEM TO BE SOLVED: To achieve a current probe array for measuring the lead current of an LSI by placing it on an already installed LSI tester. ;SOLUTION: A current probe 2 in a configuration enabling connection to a leading wire 3 is incorporated on the upper surface or the surface layer of an insulation substrate 4. Each pin of an LSI tester is inserted into a hole 21 of each current probe 3 to measure current that flows to each pin, thus measuring the lead current of the LSI by placing a current probe array on an already installed LSI tester since the side of the LSI tester needs not be changed at all.;COPYRIGHT: (C)1999,JPO
机译:要解决的问题:通过将电流探头阵列放置在已经安装的LSI测试仪上来获得用于测量LSI引线电流的电流探头阵列。 ;解决方案:在绝缘基板4的上表面或表面层上,并入了能够与导线3连接的结构的电流探针2。LSI测试器的每个引脚插入每个电流探针3的孔21中。测量流到每个引脚的电流,从而通过将电流探头阵列放置在已经安装的LSI测试仪上来测量LSI的引线电流,因为LSI测试仪的侧面根本不需要改变。;版权所有:(C)1999 ,日本特许厅

著录项

  • 公开/公告号JPH11166957A

    专利类型

  • 公开/公告日1999-06-22

    原文格式PDF

  • 申请/专利权人 NEC CORP;

    申请/专利号JP19970332251

  • 发明设计人 MASUDA KOICHIRO;

    申请日1997-12-03

  • 分类号G01R31/28;G01R1/06;G01R19/00;G01R33/02;

  • 国家 JP

  • 入库时间 2022-08-22 02:36:39

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