PLANARIZING METHOD AND PLANARIZING EQUIPMENT OF WAFER

摘要

PROBLEM TO BE SOLVED: To planarize the surface of a wafer by effectively eliminating unevenness due to undulations or the like of the wafer surface, without generating large damages. ;SOLUTION: From a gas jetting nozzle 16, an etching gas is jetted against protrusions 2a, 2b which are present on the surface of a wafer 1 and are different in size and/or height, and the protrusions are dry-etched, thereby planarizing the wafer surface. The jetting state of the etching gas is changed, in accordance with the size and/or the height of the protrusions 2a, 2b.;COPYRIGHT: (C)1999,JPO