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COATING FLUID FOR FORMING SILICEOUS COATING FILM AND SILICEOUS COATING FILM OBTAINED THEREFROM

机译:用于形成硅质涂料膜的涂料液和从此获得的硅质涂料膜

摘要

PROBLEM TO BE SOLVED: To obtain a coating fluid having good film formability and giving a siliceous coating film having low permittivity by using a siloxane oligomer comprising specified repeating units. ;SOLUTION: This fluid contains a siloxane oligomer comprising repeating units represented by the formula (wherein R is a 1-4C alkyl, (substituted)phenyl, or (substituted)perfluorophenyl). This oligomer can be obtained by the hydrolytic polycondensation of a monoorganodichlorosilane or a monoorganodialkoxysilane. To form an oxide coating film by using the fluid, the fluid is applied to a substrate such as glass, ceramics, a silicon wafer, or a silicon wafer on which a circuit is formed by e.g. immersion or spin coating, the wet film is dried at 50-200°C, desirably, 100-150°C, and the dried film is backed at 300-500°C.;COPYRIGHT: (C)1999,JPO
机译:解决的问题:通过使用包含指定的重复单元的硅氧烷低聚物,获得具有良好的成膜性并得到介电常数低的硅质涂膜的涂布液。 ;解决方案:该流体包含硅氧烷低聚物,该硅氧烷低聚物包含由下式表示的重复单元(其中R为1-4C烷基,(取代的)苯基或(取代的)全氟苯基)。该低聚物可以通过单有机二氯硅烷或单有机二烷氧基硅烷的水解缩聚而获得。为了通过使用该流体形成氧化物涂膜,将该流体施加到诸如玻璃,陶瓷,硅晶片或通过例如电沉积法在其上形成电路的硅晶片的基板上。浸涂或旋涂,将湿膜在50-200°C下干燥,最好在100-150°C下干燥,然后将干膜在300-500°C下进行底涂;版权:(C)1999,JPO

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