SUBSTRATE WIRING SYSTEM, WIRING SUBSTRATE, SEMICONDUCTOR IC PACKAGE SUBSTRATE, SEMICONDUCTOR IC PACKAGE, SEMICONDUCTOR IC AND CAD SYSTEM FOR SUBSTRATE DESIGN

摘要

PROBLEM TO BE SOLVED: To execute wiring by means of two layers in a short distance, by providing via holes connecting radial wirings and circular wirings in crossing parts. ;SOLUTION: Pairs of feeding wirings 1 and 2 are constituted of straight wirings 1a and 2a in radial directions which are decided by angles, circular wirings 1r and 2r which are decided by a radius from a center, and via holes 1v and 2v connecting the straight wirings 1a and 2a and the circular wirings 1r and 2r. A signal wiring 3 is constituted of via holes 3v connecting straight wirings 3a for the whole length of the radial direction or a part of which are decided by the angle, and circular wirings 3r for the whole length or a part of it which are decided by the radius. Thus, power/ground/signal wirings are wired by the two layers and wiring structure against feeding noise even in wiring feeding can be obtained. When it is applied to a wiring substrate having multiple connections especially in the radial direction, the wirings with considerably short line length can be realized.;COPYRIGHT: (C)1999,JPO