SEMICONDUCTOR MANUFACTURING APPARATUS EQUIPPED WITH ELECTROSTATIC ATTRACTION DEVICE WITH FOREIGN MATTER REMOVAL FUNCTION

摘要

PROBLEM TO BE SOLVED: To obtain a semiconductor manufacturing apparatus in which a foreign matter existing in an electrostatic attraction part coming into contact with the backside of a wafer to be treated is transferred to a sheetlike member so as to be removed by a method wherein the sheetlike member installed in a wafer converance route is attracted by applying a voltage in such a way that its charged polarity is opposite to that of the foreign matter irrespective of the polarity of the applied voltage in the attraction of the wafer to be treated. ;SOLUTION: A sheetlike member 10 capable of covering a part coming into contact with the backside of a wafer 9 to be treated is attracted in the same manner as in an ordinary wafer, to be treated, so as to be conveyed, and a foreign matter 14 in a part with which the backside of the wafer 9 comes into contact is transferred to the side of the sheetlike member 10 so as to be removed. At this point, irrespective of the polarity of an applied voltage in the attraction of the wafer 9, a voltage whose polarity is opposite to the polarity of the foreign matter 14 is applied to an electrostatic attraction arm, the sheetlike member 10 is attracted, and the foreign matter 14 is stuck easily to the side of the sheetlike member 10. Here, when the foreign matter 14 on the surface of, e.g. a dielectric 11 is charged with electricity to be negative, a negative voltage is applied to an electrode 12, and the foreign matter 14 is repelled so as to be transferred to the side of the wafer 9. Thereby, the electrostatic attraction arm is kept in a clean state.;COPYRIGHT: (C)1999,JPO