Warping adjustment and appearance inspection and IC electric ON test method null of IC lead/read by the transferring device from IC magazine

摘要

PURPOSE: To enhance the throughput of the title apparatus by reducing the number of correction processes and inspection processes when an IC is manufactured. ;CONSTITUTION: An IC is moved, through an opening and shutting inside a through hole 8, from an IC magazine 9 to a rail mechanism 11 in which leads 13 for the IC 1 are exposed from side faces; the IC leads 13 are corrected and the like here; the IC 1 is moved and housed in the IC magazine 9 again through the opening and shutting mechanism inside the through hole 8.;COPYRIGHT: (C)1993,JPO&Japio