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Tin and tin - burble liquid null of lead alloy

机译:锡和铅锡的脆性液态锡

摘要

PURPOSE:To obtain the soln. capable of releasing a tin or tin-lead alloy layer in a short time without eluting the base copper by incorporating an org. sulfonic acid, in aromatic nitro-substituted compd., thiourea, benzotriazole and catechol into the soln. CONSTITUTION:The aq. soln. which contains an aliphatic or aromatic org. sulfonic acid, an aromatic nitro-substituted compd., thiourea or its derivative, benzotriazole or its derivative and catechol is used for selectively releasing a tin or tin-lead alloy layer. In this case, the base copper is hardly eluted, and the deposition by substitution with the eluted tin or lead is not caused. The soln. appropriately contains about 1g/l of an org. sulfonic acid, about 0.5g/l of a saturated aromatic nitro compd., about 0.5 to 10g/l of a saturated thiourea, abut 0.1 to 5g/l benzotriazole and about 0.1-10g/l of catechol. The soln. having such a composition is used for a dipping or spraying method at about 30 to 45 deg.C, and the tin or tin-lead alloy layer is released in a short time without damaging the base copper.
机译:目的:获得Soln。通过并入有机基团能够在短时间内释放锡或锡铅合金层而不会洗脱基础铜。芳族硝基取代化合物中的磺酸,硫脲,苯并三唑和邻苯二酚进入溶液。宪法:水溶液。 soln。含有脂肪族或芳香族的有机基团磺酸,芳香族硝基取代的化合物,硫脲或其衍生物,苯并三唑或其衍生物和邻苯二酚用于选择性释放锡或锡铅合金层。在这种情况下,基本铜几乎不被洗脱,并且不引起通过被洗脱的锡或铅的取代而引起的沉积。索恩适当地包含约1g / l的组织。磺酸,约0.5g / l的饱和芳族硝基,约0.5-10g / l的饱和硫脲,约0.1-5g / l的苯并三唑和约0.1-10g / l的邻苯二酚。索恩具有这样组成的具有约30-45℃的浸渍或喷涂方法,锡或锡铅合金层在短时间内脱模而不会损坏基础铜。

著录项

  • 公开/公告号JP2898297B2

    专利类型

  • 公开/公告日1999-05-31

    原文格式PDF

  • 申请/专利权人 DAIWA KASEI KENKYUSHO KK;

    申请/专利号JP19890070583

  • 发明设计人 TAKEUCHI TAKAO;MASAKI SEIJI;

    申请日1989-03-24

  • 分类号C23F1/30;H05K3/26;

  • 国家 JP

  • 入库时间 2022-08-22 02:30:29

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