Lead/read reform manner of semiconductor equipment and implemental manner null

摘要

PURPOSE: To prevent solder bridges from being produced on a wiring board by a method wherein an external lead is enhanced in evenness, and solder paste printed on the wiring board is lessened in thickness. ;CONSTITUTION: A solder paste 3a is printed on a wiring board 2. A semiconductor device 1 is mounted on the wiring board 2. A weight 5 is placed on the semiconductor device 1. Resin is softened by heating, and a solder reflow process is performed.;COPYRIGHT: (C)1994,JPO