JIG FOR DETECTING HEIGHT OF WAVY SOLDER SURFACE, METHOD OF CONTROLLING HEIGHT OF SOLDER SURFACE, SOLDERING APPARATUS, JIG FOR DETECTING WARP OF PRINTED CIRCUIT BOARD, AND METHOD OF PRODUCING CIRCUIT BOARD

摘要

THE PRESENT INVENTION IS DIRECTED TO A JIG FOR DETECTING THE HEIGHT OF A WAVY SURFACE OF MOLTEN SOLDER (11) OR JET SOLDER, A METHOD OF CONTROLLING SUCH A HEIGHT, A SOLDERING APPARATUS, A JIG FOR DETECTING A WARP OF A PRINTED CIRCUIT BOARD (40), AND A METHOD OF PRODUCING A PRINTED CIRCUIT BOARD (40). WITH SUCH DEVICE APPARATUS AND METHOD, THE OPTIMUM SOLDERED CONDITION SOLDERED CAN ALWAYS BE MAINTAINED AND CONTROLLED. THE SOLDERING APPARATUS INCLUDES A DETECTION JIG (30) FOR DETECTING THE HEIGHT OF THE WAVY MOLTEN SOLDER SURFACE (11) OR THE WARP OF THE PRINTED CIRCUIT BOARD (10), THE DETECTION JIG HAVING A PLURALITY OF DISPACEMENT SENSORS (8) PROVIDED AT PREDETERMINED INTERVALS IN A DIRECTION OF TRAVEL OF THE PRINTED CIRCUIT BOARD (40). BY KEEPING AND CONTROLLING THE WAVY SOLDER SURFACE (11) TO THE OPTIMUM CONDITION, THE CHANGE IN THE KIND OF PRINTED CIRCUIT BOARD (40), HAVING VARIOUS ELECTRONIC PARTS MOUNTED THEREON, CAN BE RAPIDLY DEALT WITH, THEREBY ACHIEVING AN IMPROVED YIELDRATE OF THE SOLDERING, AN IMPROVED PRODUCTION EFFICIENCY, AND A STABLE QUALITY OF THE PRINTED BOARD (40).(FIG. 1)