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Data hierarchy layout correction and verification method and apparatus

机译:数据层次结构布局校正与验证方法及装置

摘要

A method for performing design rule checking on an optical proximity correction (OPC) corrected or otherwise corrected designs is described. The corrected design is accessed to generate a simulated image (2010). The simulated image corresponds to a simulation of an image which would be printed on a wafer if the wafer was exposed to an illumination source directed through the corrected design (2020). The characteristics of the illuminaiton source are determined by a set of lithography parameters. In creating the image, additional characteristics can be used to simulate portions of the fabrication process. The simulated image can then be used by the design rule checker. Importantly, the simulated image can be processed to reduce the number of vertices in the simulated image, relative to the number of vertices in the OPC corrected design layout (2020). Also, the simulated image can be compared with an ideal layout image, the results of which can then be used to reduce the amount of information that is needed to perform the design rule checking.
机译:描述了一种用于对光学接近校正(OPC)校正或以其他方式校正的设计执行设计规则检查的方法。访问校正后的设计以生成模拟图像(2010年)。模拟图像对应于图像的模拟,如果晶片暴露于经过校正设计的照明源(2020),该图像将被印刷在晶片上。照明源的特性由一组光刻参数确定。在创建图像时,可以使用其他特性来模拟制造过程的各个部分。然后,设计规则检查器可以使用模拟的图像。重要的是,相对于OPC校正的设计布局(2020)中的顶点数,可以对模拟图像进行处理以减少模拟图像中的顶点数。而且,可以将模拟图像与理想的布局图像进行比较,然后将其结果用于减少执行设计规则检查所需的信息量。

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