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Joined body of aluminum nitride series ceramics, method of joining aluminum nitride series ceramics and joining agent

机译:氮化铝系陶瓷的接合体,氮化铝系陶瓷和接合剂的接合方法

摘要

A novel method is provided for joining substrates made of aluminum nitride series ceramics to each other, which can perform the joining substantially without leaving an intervening third phase other than aluminum nitride series ceramics at the joining interface of the substrates. The method is performed, for example, by providing a joining agent 3 containing at least an aluminum nitride series ceramics and a flux between the substrates 1 and 2, heat treating the joining agent to eutectically melt the aluminum nitride series ceramics and the flux, then precipitating a reprecipitated phase of the aluminum nitride series ceramics at the joining interface of the substrates. Alternatively, the method is performed by providing a joining agent 3 containing at least an aluminum nitride series ceramics and a flux between the substrates 1 and 2, heating the joining agent to a temperature range T1 which is higher than the melting point of the flux, subsequently heating the joining agent to a temperature range T2 which is higher than the temperature range T1 to exit the components of the flux from the joining interface, ten precipitating the reprecipitated phase of the aluminum nitride series ceramics at the joining interface.
机译:提供了一种用于将由氮化铝系列陶瓷制成的基板彼此接合的新颖方法,该方法可以基本上执行接合而不会在基板的接合界面处留下除氮化铝系列陶瓷以外的中间第三相。该方法例如通过在基板1和2之间提供至少包含氮化铝系列陶瓷和焊剂的接合剂3,对接合剂进行热处理以将氮化铝系列陶瓷和焊剂完全熔融,然后进行。在基板的接合界面处沉淀出氮化铝系列陶瓷的沉淀相。或者,通过在基板1与基板2之间设置至少包含氮化铝系陶瓷和焊剂的接合剂3,将接合剂3加热至比焊剂的熔点高的温度范围T1,来进行。随后将接合剂加热到高于温度范围T1的温度范围T2,以使焊剂的成分从接合界面中逸出,十次沉淀氮化铝系列陶瓷在接合界面处的再沉淀相。

著录项

  • 公开/公告号EP0856499A3

    专利类型

  • 公开/公告日1998-12-30

    原文格式PDF

  • 申请/专利权人 NGK INSULATORS LTD.;

    申请/专利号EP19980300594

  • 发明设计人 OHASHI TSUNEAKI;IMAI TSUTOMU;

    申请日1998-01-28

  • 分类号C04B37/00;

  • 国家 EP

  • 入库时间 2022-08-22 02:21:00

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