首页> 外国专利> Modeling Method for Reduced Surface Field Transverse Double-Diffusion Morse Transistor Using Silicon-on-Insulator Substrate

Modeling Method for Reduced Surface Field Transverse Double-Diffusion Morse Transistor Using Silicon-on-Insulator Substrate

机译:绝缘体上硅衬底的减小表面场横向双扩散莫尔斯晶体管的建模方法

摘要

A modeling method for a reduced surface electric field (RESURF) type lateral double-diffusion MOS (LDMOS) transistor using a silicon-on-insulator (SOI) substrate is disclosed. By representing the breakdown voltage BVVF of the transistor as a function of the concentration Nepi of the drift region and the thickness Tbox of the buried oxide layer, the optimum length Ldr and the thickness of the drift region are applied by applying the condition that the breakdown in the horizontal direction and the vertical breakdown occur simultaneously. Find the depi. In addition, the on-resistance RON of the transistor is represented by the term of the channel resistance Rch and the resistance Rdr of the drift region, so that the optimum on-resistance RON using the length Ldr and the concentration Nepi of the optimum drift region obtained from the breakdown voltage BVVF is obtained. Obtain
机译:公开了一种使用绝缘体上硅(SOI)衬底的减小表面电场(RESURF)型横向双扩散MOS(LDMOS)晶体管的建模方法。通过将晶体管的击穿电压BVVF表示为漂移区的浓度Nepi和掩埋氧化物层的厚度Tbox的函数,通过施加击穿的条件来施加最佳长度Ldr和漂移区的厚度在水平方向和垂直击穿同时发生。找到部门。另外,晶体管的导通电阻RON由沟道电阻Rch和漂移区的电阻Rdr的项表示,因此,使用长度Ldr和最优漂移的浓度Nepi来最优导通电阻RON获得从击穿电压BVVF获得的区域。获得

著录项

  • 公开/公告号KR19980084367A

    专利类型

  • 公开/公告日1998-12-05

    原文格式PDF

  • 申请/专利权人 배순훈;

    申请/专利号KR19970020138

  • 发明设计人 이찬희;

    申请日1997-05-23

  • 分类号H01L27/12;

  • 国家 KR

  • 入库时间 2022-08-22 02:18:51

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